Samsung Electro-Mechanics Co., Ltd.

Soon-Jin Cho

Seok-Hwan Ahn

Chung-Woo Cho

Seung-Hyun Cho

Dong-Jin Park

Dong-Gyu Lee

Byung-Bae Seo

Seung-Chul Kim

Jin-Won Choi

Ki-Young Yoo

Seung-Hyun Jung

A printed circuit board manufacturing system and a manufacturing method thereof are disclosed. A method of manufacturing printed circuit board, comprising: providing a substrate that comprises a pad and an insulation layer covering the pad; acquiring an image of the substrate; acquiring location information of the pad by analyzing the image of the substrate; forming a via hole by removing a part of the insulation layer that corresponds the location information of the pad; and forming a via by filling the via hole with a conductive material, provides improved process conformity, even if the substrate has partial or nonlinear deformation, by considering the location information of the pad in the via hole forming. The improved conformity may allow more flexibility to substrate design and more integrity for circuitries on printed circuit board.

Printed circuit board manufacturing system and manufacturing method thereof

A method of manufacturing a printed circuit board is disclosed. The method may include: sequentially stacking an acid-resistant first cover layer and an alkali-resistant second cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the second cover layer, the first cover layer, and the copper clad laminate; stacking a seed layer over the intaglio groove and the second cover layer; removing a portion of the seed layer stacked over the second cover layer, by stripping the second cover layer; forming a plating layer, by plating an inside of the intaglio groove; stripping the first cover layer; and removing the copper foil exposed by the stripping of the first cover layer.

Method of manufacturing printed circuit board

A coreless substrate having a plurality of function pads, etched from a metal sheet and having a protruded shape; an insulating layer, the insulating layer being formed on one side of the function pads, a circuit corresponding to a pattern being formed on the insulating layer, a via hole being formed on the insulating layer to electrically connect the function pads and the circuit; and a solder resist, being formed on the insulating layer to protect the surface of the insulating layer. The coreless substrate has a signal delivery characteristic that is improved by eliminating the inner via hole.

Coreless substrate

A wafer packaging method is disclosed. An aspect of the invention is to provide a wafer packaging method comprising;

Wafer packaging method

The present invention discloses a method for manufacturing a coreless substrate. The method comprises the steps of (a) forming an insulating layer on one side of a metal sheet; (b) forming a via hole on the insulating layer for electrical connection between the metal sheet and the other side; and (c) forming a plurality of protruded function pads by etching the metal sheet. The coreless substrate and manufacturing method thereof in accordance with the present invention have the signal delivery characteristic that is improved by eliminating the inner via hole.

Growing community of inventors

Suwon-si, South Korea

Soon-Jin Cho