The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 13, 2011
Filed:
Jun. 18, 2008
Dong-jin Park, Seongnam-si, KR;
Seung-hyun Jung, Suwon-si, KR;
Seung-chul Kim, Cheongju-si, KR;
Soon-jin Cho, Suwon-si, KR;
Dong-Jin Park, Seongnam-si, KR;
Seung-Hyun Jung, Suwon-si, KR;
Seung-Chul Kim, Cheongju-si, KR;
Soon-Jin Cho, Suwon-si, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
A method of manufacturing a printed circuit board is disclosed. The method may include: sequentially stacking an acid-resistant first cover layer and an alkali-resistant second cover layer over a copper foil, for a copper clad laminate that includes the copper foil stacked over one side of an insulation layer; forming an intaglio groove by removing portions of the second cover layer, the first cover layer, and the copper clad laminate; stacking a seed layer over the intaglio groove and the second cover layer; removing a portion of the seed layer stacked over the second cover layer, by stripping the second cover layer; forming a plating layer, by plating an inside of the intaglio groove; stripping the first cover layer; and removing the copper foil exposed by the stripping of the first cover layer.