This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2004.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2004
Title: Innovations by Sook Chien Chan
Introduction
Sook Chien Chan is a notable inventor based in Penang, Malaysia. She has made significant contributions to the field of technology, particularly in the area of interconnecting components through innovative methods.
Latest Patents
Sook Chien Chan holds a patent for an "Apparatus and methods for interconnecting components to via-in-pad interconnects." This invention involves a substrate that features at least one via-in-pad, which includes a bond pad and a bore. The substrate is designed with a plug that is coupled to the via-in-pad, utilizing a first conductive material that has a higher reflow temperature than a second conductive material used in a solder ball.
Career Highlights
Sook Chien Chan is currently employed at Intel Corporation, where she continues to develop and refine her innovative ideas. Her work at Intel has allowed her to be at the forefront of technological advancements in her field.
Collaborations
She collaborates with talented individuals such as Kum Foo Leong and C Key Chung, contributing to a dynamic and innovative work environment.
Conclusion
Sook Chien Chan's contributions to technology through her patent and work at Intel Corporation highlight her role as a significant inventor in the industry. Her innovative approaches continue to pave the way for advancements in component interconnection technologies.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile