The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2004
Filed:
Oct. 08, 2002
Applicant:
Inventors:
Assignee:
Intel Corporation, Santa Clara, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/16 ;
U.S. Cl.
CPC ...
H05K 1/16 ;
Abstract
A substrate has at least one via-in-pad that includes a bond pad and a bore. In addition, the substrate has a plug coupled to the at least one via-in-pad, the plug has a first conductive material and adapted to couple with a solder ball having a second conductive material, the first conductive material having a higher reflow temperature than the second conductive material.