Location History:
- Kodah, MY (2004)
- Kedah, MY (2007 - 2010)
Company Filing History:
Years Active: 2004-2010
Title: Innovations of Kum Foo Leong
Introduction
Kum Foo Leong is a notable inventor based in Kedah, Malaysia. He has made significant contributions to the field of integrated circuit packaging, holding a total of 4 patents. His work focuses on enhancing the performance and reliability of electronic components.
Latest Patents
One of his latest patents is titled "Solder interface locking using unidirectional growth of an intermetallic compound." This invention involves a ball grid array device that includes a substrate with an array of pads. The pads feature a barrier layer that forms an intermetallic compound at a different rate than the compound formed between the pad and the solder. This innovation results in a solder ball on a pad that contains both a first and a second intermetallic compound.
Another significant patent is "Stitched micro-via to enhance adhesion and mechanical strength." This method involves forming a via in an integrated circuit packaging substrate by embedding an interfacial adhesion layer at the base of the via. The process includes heating the materials at the base and placing a conductive material over the interfacial adhesion layer. This innovative approach improves the mechanical strength and adhesion of the integrated circuit packaging substrate.
Career Highlights
Kum Foo Leong is currently employed at Intel Corporation, where he continues to develop cutting-edge technologies in the electronics industry. His expertise in integrated circuit packaging has positioned him as a valuable asset to the company.
Collaborations
Throughout his career, Kum Foo Leong has collaborated with talented individuals such as Chee Key Chung and Kian Sin Sim. These partnerships have fostered innovation and contributed to the advancement of their projects.
Conclusion
Kum Foo Leong's contributions to the field of integrated circuit packaging are noteworthy. His innovative patents demonstrate his commitment to enhancing electronic component performance. His work at Intel Corporation and collaborations with skilled colleagues further highlight his impact in the industry.