Soo Loo Ang

Title: The Innovations of Soo Loo Ang

Introduction

Soo Loo Ang is a prominent inventor based in Singapore, known for his contributions to the field of semiconductor technology. With a total of 4 patents to his name, he has made significant advancements in methods related to semiconductor devices and their packaging.

Latest Patents

Soo Loo Ang's latest patents focus on innovative methods of making semiconductor devices. One of his notable inventions involves cutting kerfs in streets between regions of a semiconductor wafer and positioning stacks of semiconductor dice on portions of surfaces of adjacent regions. This method includes dispensing a protective material only between the stacks of semiconductor dice, over the exposed remainders of the regions, and in the kerfs. The back side of the semiconductor wafer is then ground to a final thickness, revealing the protective material in the kerfs at the side opposite the stacks of semiconductor dice. Another patent details methods of protecting semiconductor devices by cutting partially through the thickness of a semiconductor wafer to form trenches between stacks of semiconductor dice. A protective material is dispensed into these trenches, ensuring it reaches a level substantially the same as the height of the stacks of semiconductor dice.

Career Highlights

Throughout his career, Soo Loo Ang has worked with notable companies such as Micron Technology Incorporated and Rokko Ventures Pte Ltd. His experience in these organizations has contributed to his expertise in semiconductor technology and innovation.

Collaborations

Soo Loo Ang has collaborated with esteemed colleagues, including Zhaohui Ma and Wei Zhou, further enhancing his work in the semiconductor field.

Conclusion

Soo Loo Ang's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative methods continue to shape the future of semiconductor devices.