This inventor holds 4 USPTO granted patents. Top assignee: Texas Instruments Corporation. Active years: 2004-2011.
Location History:
- Beppu Oita, JP (2004)
- Oita, JP (2008)
- Beppu, JP (2010)
- Oita-ken, JP (2011)
Company Filing History:
Years Active: 2004-2011
Title: Sohichi Kadoguchi: Innovator in Wirebonding Technology
Introduction
Sohichi Kadoguchi is a prominent inventor based in Beppu, Japan. He has made significant contributions to the field of electronic device assemblies, particularly in the area of wirebonding technology. With a total of 4 patents to his name, Kadoguchi's work has had a substantial impact on the industry.
Latest Patents
One of his latest patents is focused on "Spot Heat Wirebonding." This invention discloses methods and systems for forming secure wirebonds between electrical contacts in electronic device assemblies. The representative embodiments of this invention describe the formation of a wirebond, including system components and method steps for generating electromagnetic energy from a heat source. This energy is then transmitted to a ball formed on a bondwire. Subsequently, pressure applied to the ball at the bonding site is utilized in the formation of a wirebond.
Career Highlights
Kadoguchi is currently associated with Texas Instruments Corporation, where he continues to innovate and develop new technologies. His expertise in wirebonding has positioned him as a key figure in the advancement of electronic assembly techniques.
Collaborations
Throughout his career, Kadoguchi has collaborated with notable coworkers such as Norihiro Kawakami and Yoshikatsu Umeda. These collaborations have further enriched his work and contributed to the success of his inventions.
Conclusion
Sohichi Kadoguchi's contributions to wirebonding technology exemplify his innovative spirit and dedication to advancing electronic device assembly methods. His patents continue to influence the industry and pave the way for future developments.