The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 19, 2011

Filed:

Feb. 10, 2010
Applicants:

Norihiro Kawakami, Oita-Ken, JP;

Yoshikatsu Umeda, Oita-ken, JP;

Sohichi Kadoguchi, Oita-ken, JP;

Inventors:

Norihiro Kawakami, Oita-Ken, JP;

Yoshikatsu Umeda, Oita-ken, JP;

Sohichi Kadoguchi, Oita-ken, JP;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B23K 31/02 (2006.01); B23K 1/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

Methods and systems are disclosed for forming secure wirebonds between electrical contacts in electronic device assemblies. Representative embodiments of the invention are described for forming a wirebond including system components and method steps for generating electromagnetic energy from a heat source and transmitting heat to a ball formed on a bondwire. Subsequently, pressure applied to the ball at the bonding site is used in the formation of a wirebond.


Find Patent Forward Citations

Loading…