Beppu, Japan

Norihiro Kawakami

This inventor holds 3 USPTO granted patents. Top assignee: Texas Instruments Corporation. Active years: 2008-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Norihiro Kawakami. Retrieved from https://idiyas.com/inventor/norihiro-kawakami

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 2.6

ph-index = 1

Forward Citations = 7(Granted Patents)


Location History:

  • Beppu, JP (2008 - 2010)
  • Oita-Ken, JP (2011)

Company Filing History:


Years Active: 2008-2011

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3 patents (USPTO):Explore Patents

Title: Norihiro Kawakami: Innovator in Wirebonding Technology

Introduction

Norihiro Kawakami is a notable inventor based in Beppu, Japan. He has made significant contributions to the field of electronic device assemblies, particularly in the area of wirebonding technology. With a total of 3 patents to his name, Kawakami's work has had a substantial impact on the industry.

Latest Patents

Kawakami's latest patents focus on "Spot Heat Wirebonding." These patents disclose methods and systems for forming secure wirebonds between electrical contacts in electronic device assemblies. The representative embodiments of the invention describe the formation of a wirebond, including system components and method steps for generating electromagnetic energy from a heat source. This energy is transmitted to a ball formed on a bondwire. Subsequently, pressure applied to the ball at the bonding site is utilized in the formation of a wirebond.

Career Highlights

Kawakami is currently employed at Texas Instruments Corporation, where he continues to innovate and develop new technologies. His expertise in wirebonding has positioned him as a key player in the advancement of electronic device manufacturing.

Collaborations

Throughout his career, Kawakami has collaborated with notable colleagues, including Sohichi Kadoguchi and Yoshikatsu Umeda. These collaborations have further enhanced his contributions to the field.

Conclusion

Norihiro Kawakami's work in wirebonding technology exemplifies the spirit of innovation in the electronics industry. His patents and collaborations reflect a commitment to advancing technology and improving electronic device assemblies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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