The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 29, 2008
Filed:
Dec. 30, 2004
Sohichi Kadoguchi, Oita, JP;
Norihiro Kawakami, Beppu, JP;
Sohichi Kadoguchi, Oita, JP;
Norihiro Kawakami, Beppu, JP;
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A semiconductor device with a chip having at least one metallic bond pad () over weak insulating material (). In contact with this bond pad is a flattened metal ball () made of at least 99.999% pure metal such as gold, copper, or silver. The diameter () of the flattened ball is less than or equal to the diameter () of the bond pad. A wire () is connected to the bond pad so that the wire has a thickened portion () conductively attached to the flattened metal ball. The wire is preferably made of composed metal such as gold alloy. The composition of the flattened ball is softer than the wire. This softness of the flattened ball protects the underlying insulator against damage caused by pressure or stress, when the composed ball is attached.