This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Nxp USA, Inc.. Active years: 2018.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2018
Title: Innovator Sivanesan A/l Sathiapalan and His Contributions to Semiconductor Technology.
Introduction
Sivanesan A/l Sathiapalan is a notable inventor based in Kuala Lumpur, Malaysia. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent.
Latest Patents
Sivanesan holds a patent for a "Pre-plated substrate for die attachment." This method involves attaching a semiconductor die to a substrate by providing a substrate that includes an attachment layer at its surface. The attachment layer is protected by a flash plating layer, which has a reflow temperature that is equal to or less than that of the attachment layer. The process includes preheating the substrate, attaching the semiconductor die, and subsequently cooling both the substrate and the die.
Career Highlights
Sivanesan is currently employed at NXP USA, Inc., where he continues to work on advancements in semiconductor technology. His expertise and innovative approach have positioned him as a valuable asset in his field.
Collaborations
Sivanesan collaborates with various professionals, including his coworker David F Abdo, to further enhance the development of semiconductor technologies.
Conclusion
Sivanesan A/l Sathiapalan's contributions to semiconductor technology through his patent demonstrate his innovative spirit and commitment to advancing the industry. His work continues to influence the field and inspire future innovations.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
