Simone Frasca

Title: Simone Frasca: Innovator in Silicon Wafer Technology

Introduction

Simone Frasca is a prominent inventor based in Lausanne, Switzerland. She has made significant contributions to the field of silicon wafer technology, particularly in the manufacturing of high aspect ratio through-silicon vias. Her innovative approach has garnered attention in the industry.

Latest Patents

Simone Frasca holds a patent for a "System and method for removing scalloping and tapering effects in high aspect ratio through-silicon vias of wafers." This method involves manufacturing vias in a silicon wafer with a <110> crystal orientation and a <111> plane that is perpendicular to the wafer's surface, tilted by 35.26°. The process includes providing a mask with a rhomboidal-shaped opening on the silicon wafer's surface, aligning the edges with the <111> plane of the crystalline structure, etching a hole at the opening, and polishing the hole through anisotropic etching. This patent highlights her expertise and innovative thinking in the field.

Career Highlights

Simone Frasca is affiliated with the École Polytechnique Fédérale de Lausanne, where she continues to advance her research and development in silicon technologies. Her work has been instrumental in improving manufacturing processes and enhancing the performance of silicon wafers.

Collaborations

Throughout her career, Simone has collaborated with notable colleagues, including Edoardo Charbon and Sandro Carrara. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Simone Frasca is a trailblazer in the field of silicon wafer technology, with a focus on enhancing manufacturing processes through her patented methods. Her contributions continue to influence the industry and pave the way for future innovations.