Ecole Polytechnique Federale De Lausanne

Simone Frasca

Edoardo Charbon

Rebecca Leghziel

Sandro Carrara

A method for manufacturing vias in a silicon wafer, the silicon wafer having a &#x3c;110&#x3e; crystal orientation, and having a &#x3c;111&#x3e; plane that is perpendicular to a surface of the wafer, tilted by 35.26&#xb0;, the method comprising the steps of providing a mask having a rhomboidal-shaped opening onto a surface of the silicon wafer, such that edges of the rhomboidal-shaped opening line up with a &#x3c;111&#x3e; plane of a crystalline structure of the silicon wafer, etching a hole in the silicon wafer at the rhomboidal-shaped opening, and polishing the hole after the etching by a anisotropic etching.

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Lausanne, Switzerland

Simone Frasca