This inventor holds 1 USPTO granted patent and 3 published patent applications and 1 EPO patent. Top assignee: At&s Austria Technologie & Systemtechnik Aktiengesellschaft. Active years: 2025.
Company Filing History:
Years Active: 2025
Title: Simon Pressler: Innovator in Microwave Applications
Introduction: Simon Pressler is a notable inventor based in Graz, Austria. He has made significant contributions to the field of microwave technology, particularly through his innovative patent. His work focuses on enhancing the efficiency and functionality of component carriers used in microwave applications.
Latest Patents: Simon Pressler holds a patent for a "Component carrier for microwave applications with stack pieces interconnected at an electrically conductive connection interface." This invention features a component carrier that includes a stack with at least one electrically conductive layer structure and at least one electrically insulating layer structure. The microwave structure is embedded at least partially in the stack and is designed to excite a microwave propagation mode. The design includes at least two stack pieces interconnected at an electrically conductive connection interface, showcasing Pressler's ingenuity in this specialized field.
Career Highlights: Simon Pressler is associated with AT&S Austria Technologie & Systemtechnik Aktiengesellschaft, a leading company in the technology sector. His role at AT&S allows him to work on cutting-edge projects that push the boundaries of microwave technology. His contributions have been instrumental in advancing the company's capabilities in this area.
Collaborations: Simon collaborates with talented individuals such as Sebastian Sattler and Heinrich Trischler. Their combined expertise fosters an environment of innovation and creativity, leading to the development of groundbreaking technologies.
Conclusion: Simon Pressler's work exemplifies the spirit of innovation in the field of microwave applications. His patent and contributions to AT&S highlight his commitment to advancing technology and improving component carrier designs.