The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 20, 2026

Filed:

Nov. 05, 2021
Applicant:

At&s Austria Technologie & Systemtechnik Ag, Leoben, AT;

Inventors:

Mike Morianz, Graz, AT;

Johannes Stahr, St. Lorenzen im Mürztal, AT;

Simon Pressler, Graz, AT;

Maria Prutti, Bruck an der Mur, AT;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H10W 70/60 (2026.01); H10W 40/25 (2026.01); H10W 70/05 (2026.01); H10W 70/63 (2026.01); H10W 72/30 (2026.01); H10W 90/00 (2026.01); H10W 70/00 (2026.01); H10W 72/00 (2026.01); H10W 90/10 (2026.01);
U.S. Cl.
CPC ...
H10W 70/614 (2026.01); H10W 40/255 (2026.01); H10W 70/611 (2026.01); H10W 70/635 (2026.01); H10W 90/00 (2026.01); H10W 70/093 (2026.01); H10W 70/099 (2026.01); H10W 72/073 (2026.01); H10W 72/07331 (2026.01); H10W 72/352 (2026.01); H10W 72/874 (2026.01); H10W 90/10 (2026.01); H10W 90/734 (2026.01);
Abstract

A component carrier which includes a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a first electronic component and a second electronic component arranged in the stack, a first block and a second block arranged in the stack below the first electronic component and the second electronic component, and a third block and a fourth block arranged in the stack above the first electronic component and the second electronic component, wherein said blocks are thermally conductive.


Find Patent Forward Citations

Quick Actions:

Morianz, Mike. (2026). Component carrier with electronic components and thermally conductive blocks on both sides (U.S. Patent No. 12772873). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12772873

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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