Simon Dong

Title: Simon Dong: Innovator in Semiconductor Technology

Introduction

Simon Dong is a prominent inventor based in Shanghai, China. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His innovative work focuses on improving the efficiency and functionality of semiconductor device packages.

Latest Patents

One of Simon's latest patents is titled "Semiconductor device package having improved conductive stub coverage." This invention features a multi-layer substrate that includes a bottom layer and a top layer. It incorporates one or more dies that are mounted on and electrically coupled to the top layer of the substrate. An electromagnetic interference (EMI) shield encapsulates both the substrate and the semiconductor dies. The design includes a first plurality of conductive stubs positioned around the edges of the top layer, each with an edge portion that has a first thickness and is in contact with the EMI shield. Additionally, a second plurality of conductive stubs is positioned around the edges of the bottom layer, with each having an edge portion of a second thickness that is less than the first thickness and also in contact with the EMI shield.

Another notable patent is the "Semiconductor device package mold flow control system and method." This invention describes a semiconductor package that features a substrate with a top planar surface and a semiconductor die mounted on it. Bond wires electrically connect the semiconductor die to the substrate. Flow control dams are integrally formed with the top planar surface, protruding at locations near the bond wires. These flow control dams are designed to reduce the occurrence of wire sweep in the bond wires, enhancing the reliability of the semiconductor package.

Career Highlights

Throughout his career, Simon Dong has worked with several notable companies, including SanDisk Technologies Inc. and Western Digital Technologies, Inc. His experience in these organizations has allowed him to refine his skills and contribute to groundbreaking advancements in semiconductor technology.

Collaborations

Simon has collaborated with talented individuals such as Hope Chiu and Weiting Jiang. Their teamwork has fostered an environment of innovation and creativity, leading to the development of cutting-edge technologies in the semiconductor field.

Conclusion

Simon Dong is a distinguished inventor whose work in semiconductor technology has led to multiple patents and significant advancements in the industry. His contributions continue to shape the future of semiconductor devices, making him a key figure in this field.