The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 25, 2025
Filed:
Oct. 25, 2021
Sandisk Technologies, Inc., Milpitas, CA (US);
Simon Dong, Shanghai, CN;
Hope Chiu, Shanghai, CN;
Weiting Jiang, Shanghai, CN;
Elley Zhang, Shanghai, CN;
Kent Yang, Hsinchu, TW;
Hua Tan, Shanghai, CN;
Jerry Tang, Shanghai, CN;
Rui Guo, Shanghai, CN;
SANDISK TECHNOLOGIES, INC., Milpitas, CA (US);
Abstract
A semiconductor device package includes a multi-layer substrate including a bottom layer and a top layer. One or more dies are mounted on and electrically coupled to the top layer of the substrate. An electromagnetic interference (EMI) shield encapsulates the substrate and the semiconductor dies. A first plurality of conductive stubs is positioned around edges of the top layer of the substrate. Each of the conductive stubs includes an edge portion having a first thickness and in contact with the EMI shield. A second plurality of conductive stubs is positioned around edges of the bottom layer of the substrate. Each of the second plurality of conductive stubs includes an edge portion having a second thickness less than the first thickness and in contact with the EMI shield.