The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 13, 2024
Filed:
Sep. 30, 2021
Western Digital Technologies, Inc., San Jose, CA (US);
Hope Chiu, Shanghai, CN;
Hua Tan, Shanghai, CN;
Kent Yang, Hsinchu, TW;
Weiting Jiang, Shanghai, CN;
Jerry Tang, Shanghai, CN;
Simon Dong, Shanghai, CN;
Yuequan Shi, Shanghai, CN;
Rosy Zhao, Shanghai, CN;
SANDISK TECHNOLOGIES, INC., Milpitas, CA (US);
Abstract
A semiconductor package includes a substrate having a top planar surface and a semiconductor die mounted on the top planar surface of the substrate. Bond wires electrically connect the semiconductor die to the substrate. Flow control dams are integrally formed with the top planar surface of the substrate and each flow control dam protrudes from the top planar surface of the substrate at a location proximate to the bond wires. The flow control dams reduce the occurrence of wire sweep in the bond wires electrically connected to the substrate and semiconductor die.