Norcross, GA, United States of America

Sidharth Dalmia

This inventor holds 12 USPTO granted patents and 1 EPO patent. Top assignees: Georgia Tech Research Corporation, Avx Corporation, Jacket Micro Devices, Inc.. Active years: 2005-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Sidharth Dalmia. Retrieved from https://idiyas.com/inventor/sidharth-dalmia-7zhssguz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0


Average Co-Inventor Count = 3.6

ph-index = 10

Forward Citations = 300(Granted Patents)


Location History:

  • Alpharetta, GA (US) (2005 - 2010)
  • Norcross, GA (US) (2008 - 2013)

Company Filing History:


Years Active: 2005-2013

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12 patents (USPTO):Explore Patents

Title: Sidharth Dalmia: Innovator in High-Frequency Applications

Introduction

Sidharth Dalmia is a prominent inventor based in Norcross, GA (US), known for his significant contributions to the field of high-frequency applications. With a total of 12 patents to his name, Dalmia has made remarkable advancements in organic laminate stack-ups and polymer-based components.

Latest Patents

Dalmia's latest patents include innovations such as heterogeneous organic laminate stack-ups for high-frequency applications. These stack-ups are designed for various applications, including high-frequency RF applications. They feature inner core layers positioned between outer layers, along with bondply or prepreg layers as necessary. Discrete devices, such as surface mount components and flip chips, can be embedded within these structures. Additionally, cavities may be formed in the outer layers to house discrete devices, which can include surface mount components, flip chips, and wire bonded integrated circuits. Various caps can be utilized to seal these cavities, and shielding may be provided through vias or plated trenches. Each stack-up structure can be packaged in multiple ways, including as surface mount components or ball grid arrays.

Another notable patent involves liquid crystalline polymer and multilayer polymer-based passive signal processing components for RF/wireless multi-band applications. This invention provides fully-packaged miniature bandpass filters, baluns, diplexers, multiplexers, and couplers manufactured using liquid crystalline polymer (LCP) and other multilayer polymer-based substrates. These devices are designed for mass production on large area panels, ensuring high density and performance for multi-band wireless devices.

Career Highlights

Dalmia has worked with esteemed organizations such as Georgia Tech Research Corporation and AVX Corporation. His experience in these companies has contributed to his expertise in developing innovative technologies.

Collaborations

Throughout his career, Dalmia has collaborated with notable professionals, including George E. White and Madhavan Swaminathan. These collaborations have further enriched his work and expanded his impact in the field.

Conclusion

Sidharth Dalmia is a distinguished inventor whose work in high-frequency applications and polymer-based components has significantly advanced the industry. His innovative patents and collaborations reflect his commitment to pushing the boundaries of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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