The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 10, 2009
Filed:
Apr. 25, 2005
Vinu Govind, Decatur, GA (US);
Sidharth Dalmia, Norcross, GA (US);
Amit Bavisi, Atlanta, GA (US);
Venkatesh Sundraram, Norcross, GA (US);
Madhavan Swaminathan, Marietta, GA (US);
George White, Marietta, GA (US);
Vinu Govind, Decatur, GA (US);
Sidharth Dalmia, Norcross, GA (US);
Amit Bavisi, Atlanta, GA (US);
Venkatesh Sundraram, Norcross, GA (US);
Madhavan Swaminathan, Marietta, GA (US);
George White, Marietta, GA (US);
Georgia Tech Research Corporation, Atlanta, GA (US);
Abstract
The present invention allows for the use of chip-package co-design of RF transceivers and their components by using discrete active devices in conjunction with passive components. Two particular components are described, including voltage controlled oscillators (VCOs) and low noise amplifiers (LNAs). The high quality passive components for use in the VCOs and LNAs may be obtained by the use of embedded passives in organic substrates. Further, the embedded passives may have multi-band characteristics, thereby allowing multi-band VCOs and LNAs to be implemented with fewer components. In situations where size is a concern, the active devices and passive components utilized in an RF transceiver may be implemented in a low form factor module of less than 1.1 mm thick according to an embodiment of the invention.