Methods and apparatuses for high-performing multi-layer inductors

Abstract

Embodiments of the present invention may provide for high-performing inductor structures utilizing multi-layer organic stackups. In particular, these high-performing inductor structures may be formed of one or more stitched metal layer building blocks, which are each formed of at least two inductor sections that are vertically or horizontally aligned, and then stitched or connected together. This stitching process significantly reduces the DC/RF losses while reducing the inductance value by a substantially lower factor, thereby significant increasing the Q-factor of the resulting inductor structure. Each stitched metal layer building block may be formed on an organic dielectric layer (e.g., liquid crystalline polymer (LCP)) having a first conductive layer on a first surface and perhaps a second conductive layer on a second surface opposite the first surface. The at least two inductor sections described above may be formed by patterning or circuitizing the first conductive layer and/or the second conductive layer. Additional stitched metal layer building blocks may be stacked with at least one organic laminate layer (e.g., LCP) disposed between each pair of stitched metal layer building blocks. Plated vias may be utilized to connect one stitched metal layer building block with another stitched metal layer building block to form a resulting high-performing inductor structure.