Guangdong, China

Shuo Yang

This inventor holds 1 USPTO granted patent. Top assignee: Shenzhen Honghai Technology Co., Ltd.. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shuo Yang. Retrieved from https://idiyas.com/inventor/shuo-yang-vn4i3fuz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Shuo Yang: Innovator in Heat Sink Technology

Introduction

Shuo Yang is a prominent inventor based in Guangdong, China. He has made significant contributions to the field of heat sink technology, particularly through his innovative designs and methods. His work is characterized by a focus on enhancing the efficiency and effectiveness of thermal management solutions.

Latest Patents

Shuo Yang holds a patent for a "Silicon carbide copper-plated gold-tin-preset heat sink structure and fabrication method thereof." This invention discloses a silicon carbide copper-plated gold-tin preset heat sink structure, which includes a silicon carbide substrate, a first copper plate, a second copper plate, and a preset gold-tin layer. The design features a silicon carbide substrate that is thicker and wider than the copper plates, ensuring optimal thermal conductivity and performance.

Career Highlights

Shuo Yang is currently employed at Shenzhen Honghai Technology Co., Ltd., where he continues to develop innovative solutions in thermal management. His expertise in materials science and engineering has positioned him as a key player in the industry.

Collaborations

Shuo Yang collaborates with talented professionals such as Jiandong Han and Hong Chen. Together, they work on advancing technologies that improve heat dissipation and overall system performance.

Conclusion

Shuo Yang's contributions to heat sink technology exemplify the importance of innovation in engineering. His patent and ongoing work at Shenzhen Honghai Technology Co., Ltd. highlight his commitment to enhancing thermal management solutions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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