The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 05, 2025
Filed:
Sep. 16, 2024
Shenzhen Honghai Technology Co., Ltd., Guangdong, CN;
SHENZHEN HONGHAI TECHNOLOGY CO., LTD., Guangdong, CN;
Abstract
Disclosed is a silicon carbide copper-plated gold-tin-preset heat sink structure, including a silicon carbide substrate, a first copper plate, a second copper plate and a preset gold-tin layer, wherein the first copper plate is provided on a side of the silicon carbide substrate, the second copper plate is provided on an other side of the silicon carbide substrate, a thickness of the silicon carbide substrate is larger than thicknesses of the first copper plate and the second copper plate, a width of the silicon carbide substrate is larger than widths of the first copper plate and the second copper plate, the thickness of the first copper plate is the same as the thickness of the second copper plate, the width of the first copper plate is smaller than the width of the second copper plate, and the preset gold-tin layer is provided outside the second copper plate.