Shenzhen Honghai Technology Co., Ltd.

Shuo Yang

Hong Chen

Jiandong Han

Disclosed is a silicon carbide copper-plated gold-tin-preset heat sink structure, including a silicon carbide substrate, a first copper plate, a second copper plate and a preset gold-tin layer, wherein the first copper plate is provided on a side of the silicon carbide substrate, the second copper plate is provided on an other side of the silicon carbide substrate, a thickness of the silicon carbide substrate is larger than thicknesses of the first copper plate and the second copper plate, a width of the silicon carbide substrate is larger than widths of the first copper plate and the second copper plate, the thickness of the first copper plate is the same as the thickness of the second copper plate, the width of the first copper plate is smaller than the width of the second copper plate, and the preset gold-tin layer is provided outside the second copper plate.

Growing community of inventors

Guangdong, China

Shuo Yang