Mie, Japan

Shungo Hiratani

USPTO Granted Patents = 6 

Average Co-Inventor Count = 4.1

ph-index = 1

Forward Citations = 3(Granted Patents)


Location History:

  • Mie, JP (2018 - 2020)
  • Yokkaichi, JP (2022 - 2023)

Company Filing History:


Years Active: 2018-2023

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6 patents (USPTO):Explore Patents

Title: Shungo Hiratani: Innovator in Substrate Structures and Power Circuits

Introduction

Shungo Hiratani is a notable inventor based in Mie, Japan. He has made significant contributions to the fields of substrate structures and power circuits. With a total of 6 patents to his name, Hiratani continues to push the boundaries of innovation in his area of expertise.

Latest Patents

Hiratani's latest patents include a substrate structure designed to reduce the size of a substrate that incorporates multiple elements. This innovative structure features a base substrate with a first conductive plate and a second conductive plate, both electrically insulated from each other. The design allows for the mounting of elements on opposite surfaces of the substrate, optimizing space and functionality. Another significant patent involves a flexible circuit board on bus bars, which includes a power circuit with bus bars connected to FET terminals. This design enhances the efficiency of electrical connections and improves the overall performance of power circuits.

Career Highlights

Throughout his career, Shungo Hiratani has worked with prominent companies such as Autonetworks Technologies, Limited and Sumitomo Wiring Systems, Limited. His experience in these organizations has allowed him to refine his skills and contribute to various innovative projects.

Collaborations

Hiratani has collaborated with talented individuals in his field, including Arinobu Nakamura and Shinsuke Okumi. These partnerships have fostered a creative environment that has led to the development of groundbreaking technologies.

Conclusion

Shungo Hiratani is a distinguished inventor whose work in substrate structures and power circuits has made a lasting impact on the industry. His innovative patents and collaborations highlight his commitment to advancing technology.

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