The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 13, 2020
Filed:
May. 10, 2017
Applicants:
Autonetworks Technologies, Ltd., Yokkaichi, Mie, JP;
Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;
Sumitomo Electric Industries, Ltd., Osaka, JP;
Inventors:
Assignees:
AutoNetworks Technologies, Ltd., Yokkaichi, Mie, JP;
Sumitomo Wiring Systems, Ltd., Yokkaichi, Mie, JP;
Sumitomo Electric Industries, Ltd., Osaka-Shi, Osaka, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01L 25/18 (2006.01); H02G 3/16 (2006.01); H05K 5/00 (2006.01); H05K 5/03 (2006.01); B60R 16/023 (2006.01); H05K 7/06 (2006.01); H01L 25/07 (2006.01); H01L 23/40 (2006.01);
U.S. Cl.
CPC ...
H05K 7/20854 (2013.01); H01L 23/40 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01); H02G 3/16 (2013.01); H05K 5/00 (2013.01); H05K 5/0069 (2013.01); H05K 5/03 (2013.01); H05K 7/06 (2013.01); H05K 7/20 (2013.01); B60R 16/0238 (2013.01); H05K 7/209 (2013.01);
Abstract
Provided is a power distribution board including: a bus bar; and a heat dissipation member that is disposed on one side of the bus bar via an adhesive layer, wherein the bus bar includes a recess that is open to the adhesive layer side, and that is filled with a constituent material of the adhesive layer.