This inventor holds 2 USPTO granted patents. Top assignee: Citizen Watch Company, Ltd.. Active years: 2001-2002.
Location History:
- Tanashi, JP (2001)
- Tokorozawa, JP (2002)
Company Filing History:
Years Active: 2001-2002
Title: The Innovations of Shuichi Ishiwata
Introduction
Shuichi Ishiwata is a notable inventor based in Tokorozawa, Japan. He has made significant contributions to the field of semiconductor technology. With a total of 2 patents to his name, Ishiwata's work has had a considerable impact on the industry.
Latest Patents
Ishiwata's latest patents include a process for manufacturing semiconductor packages and circuit board assemblies. This innovative process involves forming circuit substrates, mounting integrated circuit (IC) chips on these substrates, and encapsulating the chips with resin. The semiconductor packages are then attached to a standard member and subjected to a cutting step, where they are diced into multiple circuit substrates. Another patent focuses on a semiconductor package that features an organic resin film with an opening on an electrode pad. This design allows for a protruding electrode made of low melting point eutectic solder to be formed without melting the resin film, enhancing the reliability of the semiconductor package.
Career Highlights
Shuichi Ishiwata is currently employed at Citizen Watch Company, Ltd. His work at this esteemed company has allowed him to further develop his expertise in semiconductor technology. His contributions have been instrumental in advancing the capabilities of semiconductor packages.
Collaborations
Ishiwata has collaborated with notable colleagues such as Tsutomu Ohara and Atsushi Omura. These partnerships have fostered innovation and have led to the successful development of new technologies in the semiconductor field.
Conclusion
Shuichi Ishiwata's contributions to semiconductor technology through his patents and work at Citizen Watch Company, Ltd. highlight his importance as an inventor. His innovative approaches continue to enhance the reliability and efficiency of semiconductor packages.