The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 23, 2001
Filed:
Aug. 30, 1999
Applicant:
Inventors:
Yoshihiro Ishida, Tanashi, JP;
Taichi Miyazaki, Tokorozawa, JP;
Atsushi Omura, Tokorozawa, JP;
Tsutomu Ohara, Tokorozawa, JP;
Shuichi Ishiwata, Tanashi, JP;
Assignee:
Citizen Watch Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
U.S. Cl.
CPC ...
H01L 2/348 ; H01L 2/352 ; H01L 2/940 ;
Abstract
An organic resin film,having an opening on an electrode pad is formed on a main surface of an IC chip,and a protruding electrode,formed on the electrode pad is formed of a low melting point eutectic solder. As a result, the protruding electrode,is formed without melting the organic resin film while preventing a crack from being generated by a stress applied between the electrode pad and the IC chip. Thus, the reliability of a semiconductor package can be enhanced.