The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 02, 2002
Filed:
Dec. 02, 1998
Applicant:
Inventors:
Yoshihiro Ishida, Tanashi, JP;
Kiyoshi Shimizu, Tanashi, JP;
Tetsuo Sato, Tanashi, JP;
Shinichi Nishikata, Tanashi, JP;
Shuichi Ishiwata, Tokorozawa, JP;
Atsushi Omura, Tokorozawa, JP;
Tsutomu Ohara, Tokorozawa, JP;
Assignee:
Citizen Watch Co., Ltd., Tokyo, JP;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
Semiconductor packages which are prepared by forming circuit substrates, mounting IC chips on the circuit substrates, encapsulating the IC chips on the circuit substrates with resin, and forming electrodes, are attached to a standard member. After this attaching step, the semiconductor packages are subjected to a cutting step where the semiconductor packages are diced into a plurality of circuit substrates.