Company Filing History:
Years Active: 2012-2025
Title: Innovations of Shuhei Murata
Introduction
Shuhei Murata is a prominent inventor based in Ibaraki, Japan. He has made significant contributions to the field of materials science, particularly in the development of sputtering targets. With a total of eight patents to his name, Murata's work has advanced the technology used in thin film deposition processes.
Latest Patents
Among his latest patents is a sputtering target and method for producing a sputtering target. This invention involves a sputtering target comprised of multiple members, including a target material and a base material. The first member contains aluminum (Al), while the second member contains copper (Cu). Notably, at least one of these members includes magnesium (Mg). The sputtering target features an alloy layer containing Al and Cu, which is in contact with both members and includes an Mg-containing layer with 5.0 atomic percent or more of Mg. Another significant patent is for a titanium sputtering target, which has a recrystallized structure with an average crystal grain diameter of 1 μm or less. The production method for this titanium sputtering target involves large strain processing, cold rolling, and heat treatment.
Career Highlights
Shuhei Murata has worked with notable companies such as JX Advanced Metals Corporation and JX Nippon Mining & Metals Corporation. His experience in these organizations has allowed him to refine his expertise in materials engineering and innovation.
Collaborations
Murata has collaborated with esteemed colleagues, including Takeshi Matsumura and Koji Mizuno. Their joint efforts have contributed to advancements in the field of sputtering technology.
Conclusion
Shuhei Murata's innovative work in sputtering targets has made a significant impact on materials science. His patents reflect a deep understanding of the complexities involved in thin film deposition processes. Murata's contributions continue to influence the industry and pave the way for future advancements.