The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Jun. 10, 2022
Applicant:

Jx Advanced Metals Corporation, Tokyo, JP;

Inventors:

Shuhei Murata, Ibaraki, JP;

Masaya Iwabuchi, Ibaraki, JP;

Yusuke Sato, Ibaraki, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C23C 14/34 (2006.01); B23K 20/02 (2006.01); C22C 9/06 (2006.01); C22C 21/06 (2006.01); H01J 37/34 (2006.01); B23K 101/34 (2006.01); B23K 103/18 (2006.01);
U.S. Cl.
CPC ...
C23C 14/3414 (2013.01); B23K 20/02 (2013.01); B23K 20/023 (2013.01); C22C 9/06 (2013.01); C22C 21/06 (2013.01); H01J 37/3429 (2013.01); B23K 2101/34 (2018.08); B23K 2103/18 (2018.08);
Abstract

A sputtering target comprised of a plurality of members including a target material and a base material, wherein the plurality of members includes a first member and a second member laminated to each other, wherein the first member contains Al, and the second member contains Cu, wherein at least one of the first member and the second member contains Mg, wherein the sputtering target includes an alloy layer containing Al and Cu between the first member and the second member, the alloy layer being in contact with the first member and the second member, and wherein the alloy layer further includes an Mg-containing layer containing 5.0 at % or more of Mg in at least a part of the alloy layer.


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