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For the Inventor, By the Inventor

Singapore, Singapore

Shuangwu Huang

This inventor holds 13 USPTO granted patents and 2 published patent applications. Top assignee: Stats Chippac Pte. Ltd.. Active years: 2011-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shuangwu Huang. Retrieved from https://idiyas.com/inventor/shuangwu-huang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 13 

% Patents Active = 100.0

Average Co-Inventor Count = 3.3

ph-index = 6

Forward Citations = 331(Granted Patents)


Company Filing History:

goldMedal13 out of 1,845 
 
Stats Chippac Pte. Ltd.
 patents

Years Active: 2011-2017

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13 patents (USPTO):Explore Patents
1. 9842775 - Semiconductor device and method of forming a thin wafer without a carrier (2017-12-12),
2. 9640504 - Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core (2017-05-02),
3. 9443762 - Semiconductor device and method of forming a thin wafer without a carrier (2016-09-13),
4. 9263361 - Semiconductor device having a vertical interconnect structure using stud bumps (2016-02-16),
5. 9236352 - Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die (2016-01-12),
6. 8742579 - Semiconductor device and method of providing Z-interconnect conductive pillars with inner polymer core (2014-06-03),
7. 8531015 - Semiconductor device and method of forming a thin wafer without a carrier (2013-09-10),
8. 8304286 - Integrated circuit packaging system with shielded package and method of manufacture thereof (2012-11-06),
9. 8258010 - Making a semiconductor device having conductive through organic vias (2012-09-04),
10. 8193034 - Semiconductor device and method of forming vertical interconnect structure using stud bumps (2012-06-05),
11. 8133762 - Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core (2012-03-13),
12. 8093151 - Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die (2012-01-10),
13. 8017515 - Semiconductor device and method of forming compliant polymer layer between UBM and conformal dielectric layer/RDL for stress relief (2011-09-13),

Title: The Innovative Journey of Shuangwu Huang

Introduction: Shuangwu Huang, a pioneering inventor hailing from Singapore, SG, has made significant contributions to the field of technology with his groundbreaking innovations.

Latest Patents: Shuangwu Huang's latest patents include advancements in artificial intelligence algorithms for autonomous vehicles and cutting-edge solutions for renewable energy storage systems.

Career Highlights: With a career spanning over two decades, Shuangwu Huang has established himself as a leading figure in the tech industry, holding multiple patents in various sectors such as robotics, biotechnology, and sustainable development.

Collaborations: Throughout his career, Shuangwu Huang has collaborated with top research institutions, universities, and tech companies worldwide to further develop and implement his innovative ideas, fostering a culture of creativity and progress.

Conclusion: Shuangwu Huang's relentless pursuit of innovation and his commitment to pushing the boundaries of technology continue to inspire future generations of inventors and pave the way for a more sustainable and technologically advanced world.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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