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For the Inventor, By the Inventor

Hsinchu, Taiwan

Shu-Rong Chun

USPTO Granted Patents = 21 

Average Co-Inventor Count = 7.9

ph-index = 3

Forward Citations = 27(Granted Patents)


Location History:

  • Hsinchu County, TW (2021 - 2023)
  • Hsinchu, TW (2021 - 2024)
  • Zhubei, TW (2024)

Company Filing History:

goldMedal21 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2021-2025

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21 patents (USPTO):
1. 12412817 - Integrated circuit package and method (2025-09-09),
2. 12374592 - Semiconductor device and manufacturing method thereof (2025-07-29),
3. 12300571 - Integrated circuit package and method (2025-05-13),
4. 12255174 - Bonding passive devices on active dies to form 3D packages (2025-03-18),
5. 12166015 - Semiconductor package and manufacturing method of semiconductor package (2024-12-10),
6. 12014979 - Methods of forming semiconductor packages (2024-06-18),
7. 11990381 - Integrated circuit packages having support rings (2024-05-21),
8. 11837575 - Bonding passive devices on active device dies to form 3D packages (2023-12-05),
9. 11804443 - Segregated power and ground design for yield improvement (2023-10-31),
10. 11646296 - Semiconductor package and manufacturing method of semiconductor package (2023-05-09),
11. 11538735 - Method of forming integrated circuit packages with mechanical braces (2022-12-27),
12. 11508656 - Semiconductor package and method (2022-11-22),
13. 11502013 - Integrated circuit package and method (2022-11-15),
14. 11488897 - Integrated circuit package and method (2022-11-01),
15. 11183487 - Integrated circuit package and method (2021-11-23),

Title: Innovator Spotlight: Shu-Rong Chun

Introduction

Shu-Rong Chun is a prominent inventor based in Hsinchu, Taiwan, known for his significant contributions to the field of integrated circuit packaging. With an impressive portfolio of 19 patents, Chun has been at the forefront of developing advanced technologies that enhance the performance and efficiency of electronic devices.

Latest Patents

Chun's latest patents demonstrate his innovative approach to complex semiconductor packaging solutions. One notable patent is for an integrated circuit package and method which includes a package component designed to house integrated circuit dies, surrounded by an encapsulant and a sophisticated redistribution structure. This package also features a mechanical brace coupled to sockets for enhanced stability and a thermal module that ensures effective heat dissipation.

Another of his recent patents focuses on bonding passive devices on active dies to form three-dimensional (3D) packages. This groundbreaking package integrates a substrate with an interposer and two wafers, showcasing Chun's ability to combine multiple functionalities into a single cohesive design.

Career Highlights

Shu-Rong Chun is a key figure at Taiwan Semiconductor Manufacturing Company Limited, where he has played a pivotal role in shaping the future of semiconductor technology. His innovative designs not only drive the company's success but also contribute to advancements in the electronics industry as a whole.

Collaborations

Throughout his career, Chun has collaborated with talented professionals in the field, including Hao-Yi Tsai and Tin-Hao Kuo. These partnerships have allowed for the exchange of ideas and the development of cutting-edge technologies within the dynamic environment of semiconductor research and development.

Conclusion

Shu-Rong Chun's inventive spirit and dedication to innovation have made a lasting impact on the world of integrated circuit packaging. His contributions through patents and collaborations demonstrate the importance of continuous advancement in technology, paving the way for future innovations in electronics.

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