This inventor holds 23 USPTO granted patents and 8 published patent applications, primarily in Semiconductor Packaging. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Taiwan Semiconductor Manufacturing Co., Ltd.. Active years: 2021-2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Location History:
- Hsinchu County, TW (2021 - 2023)
- Hsinchu, TW (2021 - 2024)
- Zhubei, TW (2024)
Company Filing History:
22 out of 42,872 
1 out of 481 Years Active: 2021-2026
Areas of Expertise:
Title: Innovator Spotlight: Shu-Rong Chun
Introduction
Shu-Rong Chun is a prominent inventor based in Hsinchu, Taiwan, known for his significant contributions to the field of integrated circuit packaging. With an impressive portfolio of 19 patents, Chun has been at the forefront of developing advanced technologies that enhance the performance and efficiency of electronic devices.
Latest Patents
Chun's latest patents demonstrate his innovative approach to complex semiconductor packaging solutions. One notable patent is for an integrated circuit package and method which includes a package component designed to house integrated circuit dies, surrounded by an encapsulant and a sophisticated redistribution structure. This package also features a mechanical brace coupled to sockets for enhanced stability and a thermal module that ensures effective heat dissipation.
Another of his recent patents focuses on bonding passive devices on active dies to form three-dimensional (3D) packages. This groundbreaking package integrates a substrate with an interposer and two wafers, showcasing Chun's ability to combine multiple functionalities into a single cohesive design.
Career Highlights
Shu-Rong Chun is a key figure at Taiwan Semiconductor Manufacturing Company Limited, where he has played a pivotal role in shaping the future of semiconductor technology. His innovative designs not only drive the company's success but also contribute to advancements in the electronics industry as a whole.
Collaborations
Throughout his career, Chun has collaborated with talented professionals in the field, including Hao-Yi Tsai and Tin-Hao Kuo. These partnerships have allowed for the exchange of ideas and the development of cutting-edge technologies within the dynamic environment of semiconductor research and development.
Conclusion
Shu-Rong Chun's inventive spirit and dedication to innovation have made a lasting impact on the world of integrated circuit packaging. His contributions through patents and collaborations demonstrate the importance of continuous advancement in technology, paving the way for future innovations in electronics.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile