Company Filing History:
Years Active: 2023-2025
Title: **Innovator Spotlight: Shu-Lan Chang**
Introduction
Shu-Lan Chang, an accomplished inventor based in Hsinchu, Taiwan, has made significant contributions to the field of semiconductor technology. With a total of two patents to his name, his innovative work has garnered attention within the industry, particularly for its focus on hybrid conductive structures.
Latest Patents
Among Shu-Lan Chang's latest patents is a groundbreaking method for the fabrication of ruthenium conductive structures over cobalt conductive structures. This patent outlines a detailed process that involves several critical steps. It begins with the formation of a first opening in a dielectric layer to expose a first cobalt contact, which is subsequently filled with ruthenium metal to create a ruthenium contact. The method further involves the formation of a second opening in the dielectric layer to expose a second cobalt contact and a gate structure, followed by the filling of this opening with tungsten to establish a tungsten contact. Finally, a copper conductive structure is formed on both the ruthenium and tungsten contacts, ensuring effective contact between the copper and the ruthenium metal.
Career Highlights
Shu-Lan Chang is currently associated with Taiwan Semiconductor Manufacturing Company Limited (TSMC), a leading entity in semiconductor manufacturing. His work at TSMC reflects a commitment to advancing technology and enhancing the efficiency of electronic components.
Collaborations
Collaboration has been a key aspect of Shu-Lan Chang’s career. He has worked alongside talented coworkers, including Cheng-Wei Chang and Chien-Shun Liao, to push the boundaries of innovation in semiconductor technologies. These partnerships help foster a creative environment that leads to groundbreaking advancements.
Conclusion
Shu-Lan Chang's contributions to the field of semiconductor technology through his innovative patents and work at TSMC highlight his role as a significant inventor in the industry. His collaboration with skilled peers and his commitment to advancing conductive structures position him as a noteworthy figure in the realm of technological innovation.