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For the Inventor, By the Inventor

Hsinchu, Taiwan

Shu-Jung Yang

This inventor holds 14 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Packaging. Top assignees: Industrial Technology Research Institute, Kenmec Mechanical Engineering Co., Ltd.. Active years: 2009-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shu-Jung Yang. Retrieved from https://idiyas.com/inventor/shu-jung-yang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 14 

% Patents Active = 78.6

Average Co-Inventor Count = 4.6

ph-index = 3

Forward Citations = 23(Granted Patents)


Location History:

  • Tainan County, TW (2011 - 2012)
  • Guiren Township, Tainan County, TW (2013)
  • Hsinchu, TW (2009 - 2020)
  • Tainan, TW (2016 - 2024)

Company Filing History:

goldMedal14 out of 9,312 
 
Industrial Technology Research Institute
 patents
silverMedal1 out of 2 
 
Kenmec Mechanical Engineering Co., Ltd.
 patents
where one patent can have more than one assignee

Years Active: 2009-2025

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Areas of Expertise:
Antenna-in-Package
Heat Dissipation
Heterogeneous Integration
Power Module
Submodule
Chip Package
Light Emitting Devices
Transducer
Cooling Device
Manufacturing Method
14 patents (USPTO):Explore Patents
1. 12401109 - Antenna-in-package with heat dissipation structure (2025-08-26),
2. 12352501 - Radiators and immersion tanks using the same (2025-07-08),
3. 11942396 - Heterogeneous integration semiconductor package structure (2024-03-26),
4. 11602128 - Ear tag module (2023-03-14),
5. 10818574 - Plug-in type power module and subsystem thereof (2020-10-27),
6. 10707143 - Plug-in type power module and subsystem thereof (2020-07-07),
7. 10051742 - Power module and manufacturing method thereof (2018-08-14),
8. 9418921 - Power module (2016-08-16),
9. 9240370 - Power module (2016-01-19),
10. 8408747 - Light emitting devices having heat-dissipating surface (2013-04-02),
11. 8283613 - Heat-pipe electric-power generating device (2012-10-09),
12. 8004079 - Chip package structure and manufacturing method thereof (2011-08-23),
13. 7683522 - Composite mode transducer and cooling device having the composite mode transducer (2010-03-23),
14. 7567015 - Composite mode transducer and cooling device having the composite mode transducer (2009-07-28),

Title: Inventor Shu-Jung Yang

Introduction: Shu-Jung Yang is a renowned inventor based in Hsinchu, Taiwan, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Shu-Jung Yang holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Shu-Jung Yang has worked with leading tech companies and research institutions, playing a key role in developing cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Shu-Jung Yang has collaborated with top researchers, engineers, and scientists from around the world, fostering a culture of innovation and knowledge sharing to drive progress in the field of technology.

Conclusion: Shu-Jung Yang's passion for innovation, coupled with his technical acumen and collaborative spirit, has solidified his reputation as a visionary inventor at the forefront of technological advancements in Hsinchu, Taiwan, and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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