The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 07, 2020
Filed:
May. 26, 2017
Applicant:
Industrial Technology Research Institute, Hsinchu, TW;
Inventors:
Shu-Jung Yang, Hsinchu, TW;
Yu-Lin Chao, Hsinchu, TW;
Chun-Kai Liu, Hsinchu, TW;
Ming Kaan Liang, Hsinchu, TW;
Jiin Shing Perng, Hsinchu, TW;
Assignee:
Industrial Technology Research Institute, Hsinchu, TW;
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 23/373 (2006.01); H01L 25/065 (2006.01); H01L 23/427 (2006.01); H01L 25/11 (2006.01); H01L 25/07 (2006.01); H01L 23/31 (2006.01); H01L 23/467 (2006.01); H01L 23/367 (2006.01);
U.S. Cl.
CPC ...
H01L 23/3735 (2013.01); H01L 23/36 (2013.01); H01L 23/3731 (2013.01); H01L 23/3736 (2013.01); H01L 23/427 (2013.01); H01L 25/0655 (2013.01); H01L 25/072 (2013.01); H01L 25/117 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/367 (2013.01); H01L 23/3672 (2013.01); H01L 23/467 (2013.01); H01L 2224/04105 (2013.01); H01L 2224/18 (2013.01); H01L 2224/24226 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/73267 (2013.01);
Abstract
A plug-in type power module includes a power unit and a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit. A first ceramic layer is disposed between the power unit and the heat-transfer unit. Therefore, heat generated by the power unit can be transferred from the first ceramic layer to the heat-transfer unit to increase the speed of heat dissipation. A subsystem having the plug-in type power module is also provided.