Yilan, Taiwan

Shu-Jen Sung

This inventor holds 2 USPTO granted patents. Top assignee: United Microelectronics Corp.. Active years: 2008-2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shu-Jen Sung. Retrieved from https://idiyas.com/inventor/shu-jen-sung

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 1.7

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:


Years Active: 2008-2009

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2 patents (USPTO):Explore Patents

Title: Innovations of Shu-Jen Sung

Introduction

Shu-Jen Sung is a notable inventor based in Yilan, Taiwan. He has made significant contributions to the field of interconnect structures and fabrication methods. With a total of 2 patents, his work has advanced the technology used in electronic devices.

Latest Patents

One of his latest patents is titled "Interconnect structure and fabricating method thereof." This patent describes an interconnect structure that is disposed on a substrate with a conductive part. It includes a first porous low-k layer on the substrate, a damascene structure in the first porous low-k layer that electrically connects with the conductive part, a second porous low-k layer over the first porous low-k layer and the damascene structure, and a UV cutting layer positioned between the first and second porous low-k layers. The UV cutting layer can function as either a UV reflection layer or a UV reflection-absorption layer. Another significant patent is the "Method of fabricating interconnect." This method involves forming a first dielectric layer with an opening over a substrate, filling a metal layer into the opening, and creating a material layer over both the first dielectric layer and the metal layer. A surface treatment process is then performed to form a cap layer on the surface of the metal layer.

Career Highlights

Shu-Jen Sung is currently employed at United Microelectronics Corporation, where he continues to innovate in the field of semiconductor technology. His work has been instrumental in enhancing the performance and efficiency of electronic components.

Collaborations

He has collaborated with several talented individuals, including Feng-Yu Hsu and Chih-Chien Liu, who have contributed to his projects and research endeavors.

Conclusion

Shu-Jen Sung's contributions to the field of interconnect structures and fabrication methods highlight his innovative spirit and dedication to advancing technology. His patents reflect a commitment to improving electronic device performance, making him a significant figure in the industry.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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