Shu-Huei Huang

Title: Innovations by Shu-Huei Huang in Semiconductor Packaging

Introduction

Shu-Huei Huang is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 4 patents. His work focuses on enhancing the efficiency and reliability of semiconductor packages.

Latest Patents

Huang's latest patents include a novel fabrication method for semiconductor packages. This invention provides a packaging substrate with opposite first and second surfaces, featuring a plurality of first and second conductive pads on the first surface. A chip is positioned on the first conductive pads, and conductive posts are formed on the second conductive pads. The first encapsulant encapsulates the chip and conductive posts while allowing openings to expose the upper surfaces of the conductive posts. This design increases package density and protects the chip and interconnection structure from moisture intrusion. Another patent details a similar semiconductor package and fabrication method, emphasizing the same innovative features.

Career Highlights

Shu-Huei Huang is currently employed at Siliconware Precision Industries Co., Ltd. His work at this company has been instrumental in advancing semiconductor packaging technologies. His inventions have contributed to the efficiency and performance of semiconductor devices.

Collaborations

Huang has collaborated with notable colleagues, including Lung-Yuan Wang and Cheng-Chia Chiang. These partnerships have fostered innovation and development in their shared field of expertise.

Conclusion

Shu-Huei Huang's contributions to semiconductor packaging through his patents and collaborations highlight his role as a key innovator in the industry. His work continues to influence advancements in technology and improve the reliability of semiconductor devices.