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For the Inventor, By the Inventor

Gotenba, Japan

Shoichi Shimamura

This inventor holds 4 USPTO granted patents. Top assignee: Mitsubishi Materials Corporation. Active years: 2001-2006.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shoichi Shimamura. Retrieved from https://idiyas.com/inventor/shoichi-shimamura

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 4

% Patents Active = 100.0

Average Co-Inventor Count = 4.1

ph-index = 4

Forward Citations = 81(Granted Patents)


Location History:

  • Omiya, JP (2001 - 2002)
  • Saitama, JP (2003)
  • Gotenba, JP (2006)

Company Filing History:

goldMedal4 out of 1,556 
 
Mitsubishi Materials Corporation
 patents

Years Active: 2001-2006

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4 patents (USPTO):Explore Patents
1. 7019975 - Power module and power module with heat sink (2006-03-28),
2. 6563709 - Liquid-cooled heat sink and manufacturing method thereof (2003-05-13),
3. 6483185 - Power module substrate, method of producing the same, and semiconductor device including the substrate (2002-11-19),
4. 6310775 - Power module substrate (2001-10-30),

Title: Shoichi Shimamura: Innovator in Power Module Technology

Introduction

Shoichi Shimamura is a notable inventor based in Gotenba, Japan. He has made significant contributions to the field of power module technology, holding a total of 4 patents. His work focuses on improving heat discharge characteristics in power modules, which is crucial for enhancing the longevity and efficiency of electronic devices.

Latest Patents

Among his latest patents, Shimamura has developed a power module that features an insulated circuit board fixed to a heat discharge plate. This innovative design aims to improve heat discharge characteristics without causing significant warping, thereby extending the heat cycle longevity of the module. Additionally, he has created a liquid-cooled heat sink that utilizes a malleable aluminum or aluminum alloy material. This heat sink is designed with a passage for coolant flow and incorporates corrugated fins to enhance thermal conductivity and moldability.

Career Highlights

Shoichi Shimamura is currently employed at Mitsubishi Materials Corporation, where he continues to advance his research and development efforts in power module technology. His work has been instrumental in creating solutions that address the challenges of heat management in electronic components.

Collaborations

Throughout his career, Shimamura has collaborated with esteemed colleagues such as Yoshiyuki Nagatomo and Toshiyuki Nagase. These partnerships have fostered innovation and contributed to the successful development of his patented technologies.

Conclusion

Shoichi Shimamura's contributions to power module technology exemplify the importance of innovation in enhancing electronic device performance. His patents reflect a commitment to improving heat management solutions, which are vital for the future of electronics.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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