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For the Inventor, By the Inventor

Boise, ID, United States of America

Shiyou Zhao

This inventor holds 9 USPTO granted patents. Top assignee: Micron Technology Incorporated. Active years: 2008-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Shiyou Zhao. Retrieved from https://idiyas.com/inventor/shiyou-zhao

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 9

% Patents Active = 77.8

Average Co-Inventor Count = 2.6

ph-index = 4

Forward Citations = 35(Granted Patents)


Company Filing History:

goldMedal9 out of 39,176 
 
Micron Technology Incorporated
 patents

Years Active: 2008-2017

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9 patents (USPTO):Explore Patents
1. 9622358 - Method for forming a circuit board via structure for high speed signaling (2017-04-11),
2. 9055702 - Method for forming a circuit board via structure for high speed signaling (2015-06-09),
3. 8743555 - Methods for suppressing power plane noise (2014-06-03),
4. 8516695 - Method for forming a circuit board via structure for high speed signaling (2013-08-27),
5. 8508950 - Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise (2013-08-13),
6. 7992297 - Method for forming a circuit board via structure for high speed signaling (2011-08-09),
7. 7778039 - Substrates, systems, and devices including structures for suppressing power and ground plane noise, and methods for suppressing power and ground plane noise (2010-08-17),
8. 7676919 - Method for forming a circuit board via structure for high speed signaling (2010-03-16),
9. 7459638 - Absorbing boundary for a multi-layer circuit board structure (2008-12-02),

Title: Innovations of Shiyou Zhao in Circuit Board Technology

Introduction

Shiyou Zhao is a prominent inventor based in Boise, ID (US), known for his significant contributions to circuit board technology. With a total of 9 patents to his name, Zhao has made remarkable advancements in the field of high-speed signaling.

Latest Patents

One of Zhao's latest patents is a method for forming a circuit board via structure for high-speed signaling. This invention comprises an improved method for making a via structure for use in a printed circuit board (PCB). The via allows for the passage of a signal from one signal plane to another in the PCB, transgressing the power and ground planes between the signal plane. To minimize electromagnetic disturbance between the power and ground planes, signal loss due to signal return current, and via-to-via coupling, the via is shielded within two concentric cylinders, each coupled to one of the power and ground planes.

Career Highlights

Zhao is currently employed at Micron Technology Incorporated, where he continues to innovate and develop new technologies in the realm of circuit boards. His work has been instrumental in enhancing the performance and reliability of electronic devices.

Collaborations

Some of his notable coworkers include Houfei Chen and Hao Wang, who have collaborated with him on various projects and patents.

Conclusion

Shiyou Zhao's contributions to circuit board technology exemplify the importance of innovation in the electronics industry. His patents reflect a commitment to improving high-speed signaling methods, which are crucial for modern electronic applications.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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