This inventor holds 4 USPTO granted patents. Top assignee: Matsushita Electric Industrial Co., Ltd.. Active years: 1999-2007.
Location History:
- Hirakata, JP (1999 - 2001)
- Kyotanabe, JP (2005 - 2007)
Company Filing History:
Years Active: 1999-2007
Title: Shinzou Eguchi: Innovator in Bonding Technology
Introduction
Shinzou Eguchi is a notable inventor based in Kyotanabe, Japan. He has made significant contributions to the field of bonding technology, holding a total of 4 patents. His work focuses on improving methods and apparatuses for determining the processing size of bonding materials.
Latest Patents
One of his latest patents is a method and apparatus for determining the processing size of bonding material. This invention addresses the challenges posed by temperature variations that affect the size of bonding targets. The method involves measuring the actual size of the bonding portion of a circuit electrode at a specific temperature. It then compares this size with the designed size at that temperature. Based on the comparison results, the cutting size of the bonding material is determined, allowing for precise mounting over the bonding portion.
Career Highlights
Shinzou Eguchi is currently employed at Matsushita Electric Industrial Co., Ltd., where he continues to innovate in the field of bonding technology. His expertise and inventions have contributed to advancements in the industry, enhancing the efficiency and effectiveness of bonding processes.
Collaborations
Throughout his career, Shinzou has collaborated with notable colleagues such as Akihiro Yamamoto and Sakae Kobayashi. These collaborations have fostered a creative environment that encourages innovation and the development of new technologies.
Conclusion
Shinzou Eguchi's contributions to bonding technology through his patents and collaborations highlight his role as a significant inventor in the field. His work continues to influence advancements in the industry, showcasing the importance of innovation in technology.