The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 10, 2001
Filed:
May. 10, 1999
Yoshiyuki Nagai, Toyonaka, JP;
Shinzou Eguchi, Hirakata, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
A semiconductor assembling method joins a bonding wire with a bonding object by pressing the bonding wire against the bonding object with a bonding pressurizing tool and by effecting at least one junction process of thermal junction or ultrasonic junction. The method includes steps of measuring a time elapsing from a last bonding process to a subsequent bonding process or a temperature of the pressurizing tool, and changing at least one junction condition of pressurizing force, pressurizing time, ultrasonic oscillation output, and ultrasonic oscillation time for the subsequent bonding process, based on the measured time. A semiconductor assembling apparatus includes a measuring device for measuring the time or temperature and a junction condition changing device for changing the condition to perform the method.