The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 10, 2005
Filed:
Jul. 09, 2003
Akihiro Yamamoto, Kobe, JP;
Sakae Kobayashi, Hirakata, JP;
Shinzou Eguchi, Kyotanabe, JP;
Kazuhiro Murata, Nara, JP;
Kouichi Yoshida, Moriguchi, JP;
Akihiro Yamamoto, Kobe, JP;
Sakae Kobayashi, Hirakata, JP;
Shinzou Eguchi, Kyotanabe, JP;
Kazuhiro Murata, Nara, JP;
Kouichi Yoshida, Moriguchi, JP;
Matsushita Electric Industrial Co., Ltd., Osaka, JP;
Abstract
An apparatus and method determine a size of a bonding film for bonding a bonding target having a size which varies due to temperature variation, at an environmental temperature which is different from a temperature during use. The method includes measuring an actual size of the bonding portion of the circuit electrode at the first temperature, comparing the actual size of the bonding portion with a designed size of the bonding portion at the first temperature, and determining a cutting size of the bonding material based on a comparison result and mounting the bonding material over the bonding portion.