Shiga, Japan

Shinya Uenoyama


 

Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 6(Granted Patents)


Location History:

  • Kouka, JP (2008)
  • Shiga, JP (2013 - 2015)

Company Filing History:


Years Active: 2008-2015

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3 patents (USPTO):Explore Patents

Title: Shinya Uenoyama: Innovator in Conductive Materials

Introduction

Shinya Uenoyama is a prominent inventor based in Shiga, Japan. He has made significant contributions to the field of conductive materials, holding a total of 3 patents. His work focuses on developing innovative solutions that enhance the performance and reliability of conductive particles.

Latest Patents

Uenoyama's latest patents include advancements in electrically conductive microparticles and anisotropic electrically conductive materials. One of his notable inventions is a conductive particle featuring a copper layer formed on the surface of a resin particle. This design ensures that the area ratio of voids in the copper layer's cross-section is 5% or less, while the copper itself has an average crystallite diameter of 40 nm or more. The objective of this invention is to provide a conductive particle with low initial connection resistance, which remains stable even after prolonged storage. Another patent focuses on electroconductive fine particles that facilitate reliable connections between fine electrodes, minimizing the risk of cracks or disconnections due to impact or thermal fatigue.

Career Highlights

Shinya Uenoyama is currently employed at Sekisui Chemical Co., Ltd., where he continues to innovate in the field of conductive materials. His expertise and dedication have positioned him as a key figure in the development of advanced conductive technologies.

Collaborations

Uenoyama has collaborated with notable colleagues, including Ren-de Sun and Taku Sasaki. Their combined efforts contribute to the advancement of research and development in conductive materials.

Conclusion

Shinya Uenoyama's work in the field of conductive materials showcases his innovative spirit and commitment to enhancing technology. His patents reflect a deep understanding of material science and a drive to create solutions that improve performance and reliability in various applications.

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