The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 17, 2015
Filed:
Oct. 24, 2008
Taku Sasaki, Osaka, JP;
Hiroshi Natsui, Shiga, JP;
Shinya Uenoyama, Shiga, JP;
Ren-de Sun, Osaka, JP;
Taku Sasaki, Osaka, JP;
Hiroshi Natsui, Shiga, JP;
Shinya Uenoyama, Shiga, JP;
Ren-de Sun, Osaka, JP;
Sekisui Chemical Co., Ltd., Osaka, JP;
Abstract
The present invention is a conductive particle having a copper layer formed on a surface of a resin particle, wherein in the copper layer, an area ratio of an area corresponding to voids in a cross-section in a thickness direction is 5% or less, and copper composing the copper layer has an average crystallite diameter of 40 nm or more. It is an object of the present invention to provide a conductive particle which has low initial connection resistance and which is hard to increase in connection resistance even when stored for a long period.