Sekisui Chemical Co., Ltd.

Shinya Uenoyama

Ren-de Sun

Taku Sasaki

Takeshi Wakiya

Hiroya Ishida

Hiroshi Natsui

Nobuyuki Okinaga

Kiyoto Matsushita

Masaki Okuda

Ren-De Sun

The present invention is a conductive particle having a copper layer formed on a surface of a resin particle, wherein in the copper layer, an area ratio of an area corresponding to voids in a cross-section in a thickness direction is 5% or less, and copper composing the copper layer has an average crystallite diameter of 40 nm or more. It is an object of the present invention to provide a conductive particle which has low initial connection resistance and which is hard to increase in connection resistance even when stored for a long period.

Electrically conductive microparticle, anisotropic electrically conductive material, connection structure, and method for production of electrically conductive microparticle

A conductive fine particle, which is used for conductive connection between fine electrodes and tends not to give rise to a crack in the solder layer or disconnection caused by breakage in the connection interface between an electrode and the conductive fine particle even with a drop impact and the like, and tends not to have fatigue even after repetitive heating and cooling; an anisotropic conductive material obtained by using the conductive fine particle; and a conductive connection structure.

Electroconductive fine particles, anisotropic electroconductive material, and electroconductive connection structure

A conductive particle having a low connection resistance, a small variation of conduction performance, and excellent conduction reliability and an anisotropic conductive material using such particles are disclosed. Conventional anisotropic conductive materials using conductive particles are used in the form that they are interposed between opposed boards or between opposed electrode terminals of electronic devices such as mobile telephones. However, as electronic devices have been recently developing, enhancement of the conduction reliability of the conductive particles used for the anisotropic conductive materials have been required. The surface () of the base particle of a conductive particle () of the invention used for an anisotropic conductive material is covered with a conductive film or films (). The conductive particle () has projections (b) projecting from the conductive film or films. A core material ()for projecting the surface of the conductive film is provided on the surface of the base particle. The core material () is different from the conductive material of the conductive films. By thus using such conductive particles, the conduction reliability is enhanced.

Conductive particle with protrusions and anisotropic conductive material therefrom

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Shiga, Japan

Shinya Uenoyama