This inventor holds 2 USPTO granted patents. Top assignee: Ibiden Company Limited. Active years: 2011-2012.
Company Filing History:
Years Active: 2011-2012
Title: Shinya Maeda: Innovator in Printed Wiring Board Technology
Introduction
Shinya Maeda is a notable inventor based in Ogaki, Japan. He has made significant contributions to the field of printed wiring board technology. With a total of 2 patents to his name, Maeda's work focuses on enhancing the manufacturing processes of printed wiring boards.
Latest Patents
Maeda's latest patents include a method for manufacturing printed wiring boards that features a composite layer composed of an Ni layer and a Pd layer formed on a solder pad. This innovative approach utilizes a lead-free solder on the composite layer. The palladium layer reduces issues such as solder repellency, thereby enhancing the adhesiveness of the solder. Additionally, the palladium layer's higher rigidity compared to gold allows it to absorb thermal stress, which minimizes the transmission of stress to the solder bump or layer.
Career Highlights
Shinya Maeda is currently employed at Ibiden Company Limited, where he continues to develop advanced technologies in the field of printed wiring boards. His work has been instrumental in improving the reliability and performance of electronic components.
Collaborations
Maeda has collaborated with notable colleagues such as Tsutomu Iwai and Yoshihiro Kodera. Their combined expertise has contributed to the success of various projects within the company.
Conclusion
Shinya Maeda's innovative work in printed wiring board technology showcases his commitment to advancing the field. His patents reflect a deep understanding of materials and manufacturing processes, making him a valuable contributor to the industry.