The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 17, 2011
Filed:
Mar. 15, 2005
Tsutomu Iwai, Ogaki, JP;
Yoshihiro Kodera, Ogaki, JP;
Shinya Maeda, Ogaki, JP;
Hiroyuki Watanabe, Ogaki, JP;
Kazunari Suzuki, Ogaki, JP;
Kiyotaka Tsukada, Ogaki, JP;
Tsutomu Iwai, Ogaki, JP;
Yoshihiro Kodera, Ogaki, JP;
Shinya Maeda, Ogaki, JP;
Hiroyuki Watanabe, Ogaki, JP;
Kazunari Suzuki, Ogaki, JP;
Kiyotaka Tsukada, Ogaki, JP;
Ibiden Co., Ltd., Ogaki-shi, JP;
Abstract
A composite layer composed of an Ni layerand a Pd layeris formed on a solder padU, and a solderα on the composite layer is composed of a solder containing no lead. Because a Pd layer (palladium layer) reduces phenomenons such as repellency of the solder, adhesiveness with the solder can be enhanced. Because a Pd layer has a higher degree of rigidity than a gold layer, thermal stress is absorbed into the Pd layer and buffered so as to reduce the degree of transmission of stress to the solder bump, or to the solder layer, by means of thermal stress.