Chiba, Japan

Shinya Kubota


Average Co-Inventor Count = 2.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2015-2017

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2 patents (USPTO):Explore Patents

Title: Shinya Kubota: Innovator in Semiconductor Technology

Introduction

Shinya Kubota is a prominent inventor based in Chiba, Japan. He has made significant contributions to the field of semiconductor technology, particularly in the manufacturing of resin-encapsulated semiconductor devices. With a total of 2 patents, his work has paved the way for advancements in this critical area of electronics.

Latest Patents

Kubota's latest patents include a method of manufacturing resin-encapsulated semiconductor devices and lead frames. The first patent describes a resin-encapsulated semiconductor device that comprises a semiconductor chip mounted on a die pad. A plurality of leads, each having an inner lead and an outer lead, are arranged in spaced relation from the die pad, with the inner leads facing the die pad. A metal plating layer is formed on the top surfaces of the inner leads, and these inner leads are connected by metal wires to the semiconductor chip. The encapsulation resin encapsulates the semiconductor chip, die pad, metal wires, and inner leads, leaving the outer leads exposed. The outer edge of the metal plating layer coincides with the outer surface of the encapsulation resin.

The second patent outlines a method of manufacturing a resin-encapsulated semiconductor device capable of supporting finer pitches. This involves forming a metal plating layer on both the inner lead and the outer lead of a lead. A semiconductor chip is mounted on a die pad, and an electrode on the surface of the semiconductor chip is electrically connected to the inner lead via a thin metal wire. The semiconductor chip, thin metal wire, and inner lead are encapsulated by an encapsulation resin, ensuring that the outer lead extends beyond the encapsulation resin and remains exposed. Additionally, resin burrs formed during the encapsulation process are removed by a defocused laser, and any metal adhered to the lead is lifted off.

Career Highlights

Shinya Kubota has worked with notable companies in the semiconductor industry, including Seiko Instruments Inc. and Sii Semiconductor Corporation. His experience in these organizations has contributed to his expertise in semiconductor device manufacturing.

Collaborations

One of his notable coworkers is Masaru Akino, with whom he has collaborated on various projects in the semiconductor field.

Conclusion

Shinya Kubota's innovative work in semiconductor technology, particularly in resin-encapsulated devices, showcases his significant

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