Seiko Instruments Inc

Sii Semiconductor Corporation

Shinya Kubota

Masaru Akino

A resin-encapsulated semiconductor device comprises a semiconductor chip mounted on a die pad. A plurality of leads each having an inner lead and an outer lead are arranged in spaced relation from the die pad with the inner leads facing the die pad. A metal plating layer is formed on top surfaces of the inner leads, and the inner leads are connected by metal wires to the semiconductor chip. An encapsulation resin encapsulates the semiconductor chip, die pad, metal wires and inner leads leaving the outer leads exposed. The outer edge of the metal plating layer coincides with the outer surface of the encapsulation resin and with the outer edge of the metal plating layer.

Method of manufacturing resin-encapsulated semiconductor device, and lead frame

A method of manufacturing a resin-encapsulated semiconductor device capable of supporting finer pitches comprises forming a metal plating layer on an inner lead and an outer lead of a lead. A semiconductor chip is mounted on a die pad, and an electrode on a surface of the semiconductor chip is electrically connected to the inner lead via a thin metal wire. The semiconductor chip, the thin metal wire and the inner lead are encapsulated by an encapsulation resin so that the outer lead extends beyond the encapsulation resin and is exposed. Resin burrs formed during resin encapsulation are removed by a defocused laser, and any metal adhered on the lead is lifted off.

Growing community of inventors

Chiba, Japan

Shinya Kubota